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美国、日本和荷兰已经同意加强对中国的芯片制造设备和技术的出口管制。
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该协议对中国芯片行业的影响可能与美国在10月对中国实施的单边出口管制一样重要。
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美国已经通过其更新的出口管制制度限制中国获得先进的芯片和设备,该制度阻止出售使中国代工厂在未经美国政府批准的情况下制造小于14纳米的芯片的工具。
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该协议的细节,特别是它是否会涵盖中国需要的成熟技术设备,尚未披露。
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该协议是否会涵盖中国晶圆厂所需的深紫外(DUV)设备,以及由日本供应商主导的高端光刻胶市场是否会受到限制,这些都是未知数。
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该协议的影响范围可能从禁止一些先进的DUV系统到禁止所有DUV设备,尽管由于商业利益和缺乏理由,后者的可能性较小。
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中国没有什么选择来减轻出口管制的影响,包括在12月向世界贸易组织(WTO)提出申诉,但由于美国以国家安全为由采取此举,因此不太可能在WTO框架内得到解决。
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中国在全球半导体价值链中的地位仍然很弱,它在减轻出口管制所带来的风险方面的选择有限。
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US, Japan and the Netherlands have agreed to tighten their export controls on chip manufacturing equipment and technologies to China.
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The impact of the agreement on China’s chip industry is likely to be as significant as the US’s unilateral export controls imposed on China in October.
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The US has already restricted China’s access to advanced chips and equipment through its updated export control regime, which prevents the sale of tools that enable Chinese foundries to make chips smaller than 14nm without US government approval.
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The details of the agreement, particularly whether it will cover mature technology equipment that China is in need of, are not yet disclosed.
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It is unknown whether the agreement will cover deep ultraviolet (DUV) equipment, which China requires for its wafer fabs, and whether high-end photoresists, a market dominated by Japanese suppliers, will be restricted.
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The impact of the agreement could range from banning some advanced DUV systems to all DUV equipment, though the latter is less likely due to business interests and lack of justification.
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China has few options to mitigate the impact of the export controls, including its complaint to the World Trade Organization (WTO) in December, which is unlikely to be resolved under the WTO framework as the US cited national security concerns for its move.
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China’s presence in the global semiconductor value chains remains weak, and it has limited options to mitigate the risks posed by the export controls.
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